Growing Worldwide Demand Drives Shipment of over One Million Broadcom(R) Units
IRVINE, Calif., March 13 /PRNewswire-FirstCall/ -- Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, today announced that it has shipped more than one million units of its advanced channel bonding cable modem silicon for downstream channel bonding cable modems. Compatible with existing DOCSIS(R) 2.0 and next generation cable modem termination system (CMTS) equipment, Broadcom(R) cable modem silicon delivers downstream data rates of up to 150 Megabits per second (Mbps) and enables multiple service operators (MSOs) to deploy downstream channel bonding functionality immediately, without delays or costly upgrades to their CMTS infrastructures.
Channel bonding is often cited as the most significant feature of next generation DOCSIS 3.0 products. Whereas DOCSIS2.0 products are limited to single downstream and upstream channels, next generation products will use channel bonding to combine the bandwidth of several DOCSIS channels to significantly increase data rates. Downstream channel bonding is the first of the next generation features to be deployed on a large scale. With Broadcom supporting downstream channel bonding since 2006, it continues to be the leading supplier of channel bonded cable modem silicon.
As part of the previously announced Broadcom BCM3255 family of channel bonding cable modem silicon, Broadcom's latest BCM3381 solution enables MSO customers to provide services using downstream channel bonding, well ahead of competing products. With integrated channel bonding and downstream data rates fast approaching 150 Mbps, Broadcom's single-chip BCM3381 cable modem solution supports ultra high speed data services, reduces the time required for video downloads for video-on-demand (VoD) services, and also enables the delivery of IP video content.
The success of Broadcom's single-chip BCM3381 channel bonded cable modem solution is due in large part to its compatibility with existing DOCSIS 2.0 and next generation CMTS equipment, enabling MSOs to deploy channel bonding functionality immediately. Given the growing demand by MSOs for advanced capabilities today, Broadcom has already shipped over one million units of its channel bonding cable modem silicon.
"Worldwide demand for cost effective, high speed cable services has risen dramatically as MSOs extend their product offerings with advanced capabilities such as IPTV," said Jay Kirchoff, Senior Director of Product Marketing for Broadcom's Cable TV line of business. "We're seeing strong and growing demand from customers in all regions of the world as virtually no additional investments in the CMTS infrastructure will be required for operators to enable 100+Mbps downstream data rates provided by our BCM3381 solution."
"Being a market leading service provider, Hanaro Telecom has already successfully deployed world class 100Mbps IPTV-capable cable modems built on Broadcom's BCM3381 solution," said Peter Park, Vice President of Hanaro Telecom, Inc. "Since the market in South Korea is very competitive and based on immediate delivery of information, our family of BCM3381-based data modems
has allowed us to deploy high speed data and IPTV services today, while offering forward compatibility with the next generation standard."
Since Hanaro's successful introduction of IPTV via DOCSIS downstream channel bonding technology, several other MSOs have announced downstream channel bonding plans supporting IPTV or high speed video downloads. The first of these BCM3381 applications included a gateway that supported ultra high speed data traffic, and IP video traffic, delivered to an IPTV set top box. For this application, the downstream channel bonding allowed IPTV content to be sent to multiple TVs in a single home and to multiple IPTV subscribers in a neighborhood.
Technical Information
The BCM3381 is the industry's leading single-chip DOCSIS/EuroDOCSIS channel bonding cable modem solution that combines radio frequency (RF) receivers in support of both advanced QAM and S-CDMA, an advanced QAM transmitter, a complete DOCSIS 2.0+ media access controller (MAC) with channel bonding capabilities, an 800-DMIPS communications processor, a DDR266 DRAM interface, Ethernet and USB interfaces, and expansion capabilities to support VoIP and wireless connectivity. With support for IPv6, the BCM3381 is ready for networks supporting this next generation Internet standard.
About Broadcom's Broadband Communications Group
Broadcom offers manufacturers a range of broadband communications and consumer electronics system-on-a-chip (SoC) solutions that enable voice, video and data services over residential wired and wireless networks. These highly integrated silicon solutions continue to enable the most advanced system solutions on the market, which include digital cable, satellite and IP set-top boxes and media servers, broadband modems and residential gateways, high definition and digital televisions, Blu-ray Disc(R) players recorders and personal video recorders and media PC technology.
About Broadcom
Broadcom Corporation is a major technology innovator and global leader in semiconductors for wired and wireless communications. Broadcom products enable the delivery of voice, video, data and multimedia to and throughout the home, the office and the mobile environment. We provide the industry's broadest portfolio of state-of-the-art, system-on-a-chip and software solutions to manufacturers of computing and networking equipment, digital entertainment and broadband access products, and mobile devices. These solutions support our core mission: Connecting everything(R).
Broadcom is one of the world's largest fabless semiconductor companies, with 2007 revenue of $3.78 billion, and holds over 2,500 U.S. and 1,100 foreign patents, more than 7,400 additional pending patent applications, and one of the broadest intellectual property portfolios addressing both wired and wireless transmission of voice, video and data and multimedia.
Broadcom is headquartered in Irvine, Calif., and has offices and research facilities in North America, Asia and Europe. Broadcom may be contacted at +1.949.926.5000 or at http://www.broadcom.com.
Safe Harbor Statement under the Private Securities Litigation Reform Act of 1995:
All statements included or incorporated by reference in this release, other than statements or characterizations of historical fact, are forward-looking statements. These forward-looking statements are based on our current expectations, estimates and projections about our industry and business, management's beliefs, and certain assumptions made by us, all of which are subject to change. Forward-looking statements can often be identified by words such as "anticipates," "expects," "intends," "plans," "predicts," "believes," "seeks," "estimates," "may," "will," "should," "would," "could," "potential," "continue," "ongoing," similar expressions, and variations or negatives of these words. These forward-looking statements are not guarantees of future results and are subject to risks, uncertainties and assumptions that could cause our actual results to differ materially and adversely from those expressed in any forward-looking statement.
Important factors that may cause such a difference for Broadcom in connection with BCM3381 cable set-top box and media center products include, but are not limited to, general economic and political conditions and specific conditions in the markets we address, including the volatility in the technology sector and semiconductor industry, trends in the broadband communications markets in various geographic regions, including seasonality in sales of consumer products into which our products are incorporated, and possible disruption in commercial activities related to terrorist activity or armed conflict in the United States and other locations; the rate at which our present and future customers and end-users adopt Broadcom's technologies and products in the markets for high performance digital media center applications; delays in the adoption and acceptance of industry standards in those markets; the timing, rescheduling or cancellation of significant customer orders and our ability, as well as the ability of our customers, to manage inventory; the gain or loss of a key customer, design win or order; our ability to scale our operations in response to changes in demand for our existing products and services or demand for new products requested by our customers; our ability to specify, develop or acquire, complete, introduce, market and transition to volume production new products and technologies in a cost- effective and timely manner; intellectual property disputes and customer indemnification claims and other types of litigation risk; our ability to retain, recruit and hire key executives, technical personnel and other employees in the positions and numbers, with the experience and capabilities, and at the compensation levels needed to implement our business and product plans the quality of our products and any remediation costs; changes in our product or customer mix; the volume of our product sales and pricing concessions on volume sales; the effectiveness of our expense and product cost control and reduction efforts; our ability to timely and accurately predict market requirements and evolving industry standards and to identify opportunities in new markets; problems or delays that we may face in shifting our products to smaller geometry process technologies and in achieving higher levels of design integration; the risks and uncertainties associated with our international operations; competitive pressures and other factors such as the qualification, availability and pricing of competing products and technologies and the resulting effects on sales and pricing of our products; the timing of customer-industry qualification and certification of our products and the risks of non-qualification or non-certification; the availability and pricing of third party semiconductor foundry, assembly and test capacity and raw materials; fluctuations in the manufacturing yields of our third party semiconductor foundries and other problems or delays in the fabrication, assembly, testing or delivery of our products; the risks of producing products with new suppliers and at new fabrication and assembly facilities; the effects of natural disasters, public health emergencies, international conflicts and other events beyond our control; the level of orders received that can be shipped in a fiscal quarter; and other factors.
Our Annual Report on Form 10-K, recent Current Reports on Form 8-K, and other Securities and Exchange Commission filings discuss the foregoing risks as well as other important risk factors that could contribute to such differences or otherwise affect our business, results of operations and financial condition. The forward-looking statements in this release speak only as of this date. We undertake no obligation to revise or update publicly any forward-looking statement for any reason.
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Broadcom Trade Press Contact
Laura Brandlin
Senior Director, Marketing Communications
949-926-5108
lbrandlin@broadcom.com
Broadcom Investor Relations Contact
T. Peter Andrew
Vice President, Corporate Communications
949-926-5663
andrewtp@broadcom.com
SOURCE Broadcom; BRCM Broadband
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