Milestone Accentuated With Renewed Focus
HONG KONG and MILPITAS, Calif., Sept. 26 /PRNewswire-FirstCall/ -- ASAT Holdings Limited (OTC Bulletin Board: ASTTY) (the "Company" or "ASAT"), a global provider of semiconductor package design, assembly and test services, is celebrating 20 years of providing superior semiconductor packaging, assembly, and test services.
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Throughout its history, ASAT has been a leading innovator of industry first technology for the semiconductor packaging and assembly market. This includes being the first to introduce the LPCC(TM) (Leadless Plastic Chip Carrier), the industry's first QFN, in 1998, as well as the next generation QFN, TAPP(R) (Thin Array Plastic Package) introduced in 2000.
With the convergence of market requirements such as higher levels of integration, cost effectiveness and better thermal and electrical performance, ASAT is poised to continue its role as an industry advocate due to its knowledge, experience and advanced service structure for the semiconductor packaging industry.
ASAT's longevity in serving a rapidly changing semiconductor market can be attributed to the constant innovation of better packaging solutions and assembly techniques as well as the interconnecting technologies to meet the need for increased input/output counts in the semiconductor devices. Critical to this longevity is the knowledge and expertise to advise their customers based on that accumulated experience to help them find the best solution for their applications.
"From the beginning of our existence, ASAT focused on being an advocate for the semiconductor packaging, assembly and test technologies industry," said Tung Lok Li, acting Chief Executive Officer of ASAT. "Looking ahead, we remain committed to our corporate legacy of providing our customers with the service and solutions they require for another 20 years and beyond."
"I firmly believe the next few years will be the most exciting time in our history for ASAT's customers and employees," said Jeff Osmun, President of ASAT. "All of our core capabilities and competencies fit in perfectly with the needs of our customers presently and in the coming years. We have a great opportunity to blend the best of our past with our vision for the future."
The 20th anniversary celebration underscores ASAT's commitment to delivering stable and proven solutions. This includes its expanded manufacturing operations. ASAT's state-of-the-art facility is strategically located in Dongguan, China, about 90 minutes from Hong Kong. With approximately 560,000 square feet of manufacturing space, ASAT has one of the largest and most advanced semiconductor subcontract assembly and test manufacturing facilities in China. This manufacturing center offers higher productivity, improved efficiency, and close proximity to ASAT's key end users.
About ASAT | http://www.asat.com
ASAT Holdings Limited's full suite of semiconductor package design, assembly and test services address the needs of integrated circuit companies whose products must keep pace with the growing demand for smaller, faster, and cost effective devices and at the same time offer adaptations for legacy applications within the commercial, communications and consumer electronic markets. ASAT technology services include standard and thermally enhanced leaded packages, chipscale packages, standard and high thermal performance ball grid arrays, leadless plastic chip carriers (LPCC(TM)), thin array plastic packages (TAPP(R)), system-in-package, stacked die and flip chip. ASAT has operations in Asia, Europe and the United States.
SOURCE ASAT Holdings Limited
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