Mumbai, Maharashtra, India
With electronic devices incorporating microprocessors and the integrated circuits (ICs) breaking through all barriers of Moore's Law, remarkable innovations and technologies becomes the order of the day. However, as ICs become smaller, the quantity of heat that dissipates from them becomes much higher.
This is where thermal management technology steps in to save the electronic devices from imminent failure. These solutions let the heat out into devices known as heatsinks or heatpipes on a regular basis, thereby helping to extend the life of ICs.
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Significant technological research in the area of thermal management results in several innovative and cutting-edge solutions. Such advances results in the production of specialized software tools that create a thermal design for an IC before it goes into production.
Even though there is a surplus of heat dissipation technologies, there still exists an urgent need for cost-effective, yet high quality solutions for thermal management. Heatsinks made of highly conductive metals such as copper and aluminum offer low-cost solutions to low thermal density issues.
Such sinks are also suited for high-volume production and slashing costs at the device assembly level. Composite materials such as aluminum-silicon carbide (Al-SiC) for thermal applications also bring down machining costs, and hence, the overall expenses.
"The use of computational fluid dynamics (CFD) software for thermal modeling reduces the complexities a little, but the optimization process is still a long-drawn-out process. It has to be improved considerably if thermal management is to become more efficient in ICs," says Frost & Sullivan Research Analyst Vijay Shankar Murthy.
Although a number of software solutions are available which make thermal design a lot easier, the industry is still waiting for a solution that will help achieve optimization of IC in a shorter time.
Several recent projects help to solve this issue. For instance, Daat Research Corporation recently launched OptimizeIt, a tool that makes design optimization faster and more effective. This solution helps to gauge a system's sensitivity to design variations and hone system design.
World Emerging Thermal Management Technologies, part of the Electronics and Semiconductors D918 vertical subscription service, examines innovative technologies that are fast making their way toward commercialization. The research service defines key markets and applications and reports on technology drivers as well as obstacles in the way of commercial success. Executive summaries and interviews are available to the press.
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World Emerging Thermal Management Technologies
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Shwetha Thomas, Frost & Sullivan, +91 (022) 40013429 sthomas@frost.com
Samantha Unnikrishnan, Frost & Sullivan, +91 (044) 4204 4667 sunnikrishnan@frost.com
Source: Frost & Sullivan (Business Wire India)
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