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Live 14nm 2.5D/HBM2/SerDes Seminar, presented by Samsung, ASE, eSilicon, Rambus and Northwest Logic


November 20, 2017 - Tokyo, Japan And Shanghai, China

TOKYO, JAPAN and SHANGHAI, CHINA --(Marketwired - November 20, 2017) - Samsung Electronics, ASE Group, eSilicon, Rambus and Northwest Logic have joined forces to offer a complete FinFET-based high-bandwidth memory (HBM) supply chain solution. HBM2 is a JEDEC-defined standard that utilizes 2.5D technology to interconnect an SoC with an HBM memory stack. HBM2 is being used in very high-bandwidth applications. This seminar will present a complete FinFET-based supply chain that leverages advanced IP and 2.5D technology to deliver customer designs now.

The live, in-person seminar, "14nm 2.5D/HBM2/SerDes Alliance for High-Performance Networking, Computing, Deep Learning and 5G Infrastructure," will be held in Tokyo on 11 December and in Shanghai on 14 December. The event is free, but registration is required by 18:00 on 5 December. Agenda:

10:30 Check in and networking
11:00 Samsung, HBM2 memory solution
11:30 Samsung, Foundry solution including 14nm FinFET technology
12:00 ASE, advanced 2.5D packaging
12:30 Lunch
13:30 eSilicon, ASIC and 2.5D design and implementation, HBM2 PHY, high-speed memories
14:00 Rambus, high-performance SerDes
14:30 Northwest Logic, HBM2 controller
15:00 Networking cocktail reception and lucky draws

"ASE works closely with our customers to implement HBM into their high-performance products from the early stages of development through the final product launch. We look forward to sharing our expertise in these key areas as new products come to market," said CP Hung, VP of corporate R&D, ASE Group.

"eSilicon is currently in production with HBM customer chips using its HBM2 PHY and advanced ASIC design and packaging capabilities for high-performance networking and AI," said Hugh Durdan, eSilicon's vice president of strategy and products. "We've been doing R&D in 2.5D since 2011 -- it's gratifying to have these complex ASICs become real."

"With nearly 30 years of high-speed interface design experience, Rambus develops advanced SerDes and memory IP cores that solve the power, performance and capacity challenges of communications, networking and data center markets," said Mohit Gupta, senior director product marketing at Rambus. "By working together with other leaders in the IP ecosystem to share our expertise at seminars such as these, we are excited to help our customers bring high-quality, comprehensive solutions to the market."

"Northwest Logic's highly configurable HBM2 controller is being used in a wide range of high-performance HBM2 applications. This seminar provides a great opportunity to quickly get up to speed on HBM2 and learn how it can be used to create highly differentiated products in high-performance applications," said Brian Daellenbach, president of Northwest Logic.

Registration is open and details are available on the 14nm 2.5D/HBM2/SerDes Alliance seminar page.

About Samsung Electronics Co., Ltd.
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI and Foundry. For the latest news, please visit the Samsung Newsroom at http://news.samsung.com

About ASE Group
The ASE Group is among the leading providers of independent semiconductor manufacturing services in assembly, test, materials and design manufacturing. As a global leader geared towards meeting the industry's ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and electronic manufacturing services through USI Inc and its subsidiaries, members of the ASE Group. For more information about the ASE Group, visit www.aseglobal.com or twitter @asegroup_global.

About eSilicon
eSilicon is an independent provider of complex FinFET-class ASIC design, custom IP and advanced 2.5D packaging solutions. Our ASIC+IP synergies include complete, silicon-proven 2.5D/HBM2 and TCAM platforms for FinFET technology at 14/16nm. Supported by patented knowledge base and optimization technology, eSilicon delivers a transparent, collaborative, flexible customer experience to serve the high-bandwidth networking, high-performance computing, artificial intelligence (AI) and 5G infrastructure markets.

About Rambus
Rambus creates innovative hardware and software technologies, driving advancements from the data center to the mobile edge. Our chips, customizable IP cores, architecture licenses, tools, software, services, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile payments, and smart ticketing. At Rambus, we are makers of better. For more information, visit rambus.com.

About Northwest Logic
Northwest Logic, founded in 1995 and located in Beaverton, Oregon, provides high-performance, silicon-proven, easy-to-use IP cores including high-performance PCI Express Solution (PCI Express 4.0/3.0/2.1/1.1 cores, DMA cores and drivers), Memory Interface Solution (HBM2, DDR4/3, LPDDR4/3, MRAM), and MIPI Solution (CSI-2, DSI-2, DSI). These solutions support a full range of platforms including ASICs, Structured ASICs and FPGAs.

eSilicon is a registered trademark, and the eSilicon logo is a trademark, of eSilicon Corporation. Other trademarks are the property of their respective owners.

Contacts:
Sally Slemons
eSilicon Corporation
408-635-6409
Email contact


Susan Cain
Cain Communications
408-393-4794
Email contact

MarketWire

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