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ASM International N.V. to Host Interconnect Technology Seminar


May 6, 2011 - Almere, Netherlands

ASM International N.V. (NASDAQ: ASMI) (Euronext Amsterdam: ASM) will hostan interconnect technologyseminar addressing process induced damage and electrical integrity of UltraLow-k materials, on Monday, May 9, 2011 at the International CongressCenterDresden. The seminar is being held in conjunction with the IEEEInternationalInterconnect Technology Conference (IITC) and the Materials forAdvancedMetallization Conference (MAM).

At the seminar, invited speaker Boyan Boyanov, Components Research atIntelCorporation, will discuss "Implications of process-induced damage anddielectricbreakdown for ULK materials at sub-20nm process technology nodes".

To start the program, Ivo Raaijmakers, CTO at ASM will speakabout"Towards integration of k=2 materials".

The ASM technology seminar will take place in the Seminar room3&4.The room will open at 06:30 PM for invited attendees. Thoseinterested inattending this event should reply by e-mail to IITC.Seminar@asm.com by May8.

About ASM International

ASM International N.V., headquartered in Almere, the Netherlands, and itssubsidiaries design and manufacture equipment and materials used to producesemiconductor devices. ASM International and its subsidiaries provideproductionsolutions for wafer processing (Front-end segment) as well as assembly andpackaging (Back-end segment) through facilities in the United States,Europe,Japan and Asia. ASM International's common stock trades on NASDAQ (symbolASMI)and the Euronext Amsterdam Stock Exchange (symbol ASM). For moreinformation,visit ASMI's website atwww.asm.com.

Safe Harbor Statement under the U.S. Private Securities Litigation ReformAct of1995: All matters discussed in this statement, except for any historicaldata,are forward-looking statements. Forward-looking statements involverisks anduncertainties that could cause actual results to differ materially fromthose inthe forward-looking statements. These include, but are not limited to,economicconditions and trends in the semiconductor industry generally and thetiming ofthe industry cycles specifically, currency fluctuations, financing andliquiditymatters, the success of restructurings, the timing of significant orders,marketacceptance of new products, competitive factors, litigationinvolvingintellectual property, shareholder and other issues, commercial andeconomicdisruption due to natural disasters, terrorist activity, armedconflict orpolitical instability, epidemics and other risks indicated in theCompany'sfilings from time to time with the U.S. Securities and ExchangeCommission,including, but not limited to, the Company's reports on Form 20-F and Form6-K.The Company assumes no obligation nor intends to update or revise anyforward-looking statements to reflect future developments or circumstances.

ASM International N.V. to Host Interconnect Technology Seminar:http://hugin.info/132090/R/1513327/449126.pdf


This announcement is distributed by Thomson Reuters on behalf ofThomson Reuters clients. The owner of this announcement warrants that:(i) the releases contained herein are protected by copyright and other applicable laws; and(ii) they are solely responsible for the content, accuracy and originality of the information contained therein.

Source: ASM International NV via Thomson Reuters ONE

[HUG#1513327]

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